Fusion companies sign LOIs for federal R&D awards

The Department of Commerce announced the signing of four letters of intent for federal research and development awards under the CHIPS and Science Act focused on semiconductors and power electronics, including awards for fusion companies Helion and Commonwealth Fusion Systems.

"These investments expand domestic research, secure critical supply chains, and create high-paying American jobs," said Secretary of Commerce Howard Lutnick.

According to the announcement, the Department of Commerce will receive a "minority, non-controlling and non-voting equity stake" in each company as a condition of the awards.

Helion: Helion was selected to receive up to $175 million to develop and scale high-voltage power semiconductors, which the company said are designed to deliver higher efficiency, longer operating lifetime, and more efficient cooling. The award also would support the development of advanced energy power modules designed for high-peak-current pulsed-power applications.

The technologies support the company's pulsed magneto-inertial fusion concept. Helion plans to use the semiconductors to "power, control, and harvest energy" from the magnets driving its system. According to the company, there is currently no domestic supplier capable of providing these components at the required performance level.

"Building fusion power plants at scale requires us to accelerate the development of technologies like semiconductors that are critical to making fusion possible," said David Kirtley, CEO of Helion. "This award combined with additional private investment, totaling $225 million, will allow Helion to develop and manufacture advanced semiconductors here in the United States that deliver the efficiency, reliability, and performance our systems require. It's an important investment in both America's semiconductor manufacturing base and the future of commercial fusion."

According to Helion, more than $100 million will support next-generation semiconductor research, including advances in packaging capabilities designed to integrate multiple semiconductor devices into efficient packages and approximately $80 million will support research and development for next-generation semiconductor tooling, design, and process development.

The Department of Commerce would receive a $175 million non-voting interest in Helion upon entering into a definitive award agreement, the company said.

Commonwealth Fusion Systems: CFS was selected to receive up to $85 million to develop semiconductors for radio-frequency plasma heating, power electronics, embedded systems for fusion diagnostics, and radiation-hardened electronics supporting its tokamak development.

Proposed research and development under the agreement ranges from "developing semiconductor technologies for robotic maintenance systems" to "improving radio-frequency power generators" and advancing fast and embedded controllers for plasma management, according to the company.

"This award marks an important opportunity to drive development of semiconductors and power electronics unique to the fusion industry," said Bob Mumgaard, cofounder and CEO of CFS. "These innovations will be a vital part of our global effort to deploy commercial fusion."