Dow to showcase chip-to-system materials innovation for AI and advanced packaging at SEMICON Taiwan 2026

Dow to showcase chip-to-system materials innovation for AI and advanced packaging at SEMICON Taiwan 2026

• Advanced silicone technologies to address thermal management, package stress, optical stability and system integration challenges in semiconductor systems.
• Cooling Science Studios support earlier materials screening, application testing and co-development.
• Dow will exhibit at Booth X0035 in TaiNEX 2 and host three TechXPOT sessions.

TAIPEI, Taiwan, Sept. 2, 2026 - Dow (NYSE: DOW) will showcase silicone materials and co-development capabilities designed to help semiconductor manufacturers address the thermal, mechanical and integration challenges intensifying as artificial intelligence, high-performance computing and data center applications drive demand for advanced packaging. Dow will exhibit Sept. 2-4 at Booth X0035 on Level 3 of Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2), during SEMICON Taiwan 2026.

As power density and heterogeneous integration increase, package performance depends on more than a single material property. Interfacial thermal resistance, bond-line control, stress management, materials compatibility, optical stability and long-term reliability must be considered together - and earlier in package design and qualification.

"The next generation of semiconductor performance will be shaped not only by chip architecture, but also by how materials, package structures and system's process work together," said Cathy Chu, global strategic marketing director for Consumer & Electronics, Dow Consumer Solutions. "Dow is bringing materials science into design and validation earlier. Through DOW™ Cooling Science and our Cooling Science Studios in Shanghai and Auburn, Michigan, we can work with customers to define critical-to-quality requirements, screen materials, test applications and build stronger technical evidence before high-volume manufacturing."

Dow's Cooling Science approach is designed to move collaboration beyond material selection. By evaluating material, package structure and system's process conditions in one development framework, Dow aims to help engineering teams identify potential risks earlier, improve development efficiency and accelerate qualification for next-generation semiconductor applications.

Materials science engineered for advanced semiconductor packaging

At SEMICON Taiwan, Dow will feature four application areas:

• TIM 1 for advanced computing and mobility. Silicone thermal interface materials are designed to deliver high thermal conductivity, low bond line thickness, and stable coverage to efficiently transfer heat from the die to the lid. These attributes can help deliver reliable heat dissipation from within the package and withstand package stress and warpage during thermal cycling.
• MEMS and sensor packaging. Silicone materials formulated without intentionally added PFAS are designed to meet requirements for materials compliance and sustainable objectives with robust device protection and long-term reliability for highly sensitive MEMS and sensor modules.
• High-speed optical interconnects. Silicone optical materials for optical modules, fiber array units can enable ultra-fast signal transmission, low loss of power, and high reliability by offering excellent dielectric performance, thermal stability, and mechanical compliance.
• Wafer-level and panel-level packaging. Silicone hot-melt technology is designed to support lamination and molding processes, warpage control, stress dissipation, bonding strength and large modulus applications.
  

Earlier validation through Cooling Science Studios

Dow's Cooling Science Studios in Shanghai and Auburn integrate comprehensive materials testing and application processes demonstrations to support customer projects from proof of concept and prototyping through process development. The studios give customer and Dow engineering teams a shared environment to evaluate material fit under representative package structures and process conditions.

"We want customers to bring us the package challenge, not only a material specification," Cathy Chu said. "The goal is to combine their device and process expertise with Dow's silicone technology, materials science and application testing so we can design earlier, validate together and innovate faster."

TechXPOT sessions

Dow technical experts will present at the TechXPOT Stage in the Area L Lobby on Level 4 of TaiNEX 1:

Customers, partners and members of the media are invited to visit Booth X0035 to discuss advanced packaging, thermal management, MEMS and sensor protection, optical interconnects, and wafer-level and panel-level process challenges with Dow technical experts.

About Dow

Dow (NYSE: DOW) is one of the world's leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, customer-focused innovation and leading business positions enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 29 countries and employed approximately 34,600 people as of year-end 2025. Dow delivered sales of approximately $40 billion in 2025. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us at www.dow.com.

For further information, please contact:

Ang Yi Qin
Dow
[email protected]

* Formulated without intentionally added PFAS.

NOTICE: The information contained herein is provided for informational purposes only and should not be construed as product specifications. Customers should confirm results through their own testing.