Exascale Labs and Compal Electronics to Showcase Integrated AI Infrastructure Solution at COMPUTEX Taipei 2026 (Form 8-K)

Exascale Labs and Compal Electronics to Showcase Integrated AI Infrastructure Solution at COMPUTEX Taipei 2026

Partnership delivers a fully integrated AI data center stack from compute to power, on display at COMPUTEX Taipei 2026

SAN FRANCISCO and TAIPEI, Taiwan, May 19, 2026 (GLOBE NEWSWIRE) - Exascale Labs Inc., a leading provider of next-generation AI compute infrastructure, is partnering with Compal Electronics, Inc. (Compal; TWSE: 2324), a global IT solutions leader, for a joint exhibition at COMPUTEX Taipei 2026. COMPUTEX 2026 (theme: "AI Together") will be held June 2-5, 2026 in Taipei, spanning Nangang Exhibition Center (Halls 1 & 2), the Taipei World Trade Center (TWTC), and the Taipei International Convention Center (TICC). At this premier AI and computing showcase, the two companies will showcase an integrated AI infrastructure solution at Compal's booth that combines each company's areas of leadership into a single integrated offering for enterprise and industry partners.

The joint full-stack solution pairs Compal's AI server platforms and Direct Liquid Cooling (DLC) with Exascale's Modular Data Center (MDC) and HVDC/SST power architecture. Together, these four layers - compute, cooling, infrastructure, and power - form a complete, deployment-ready AI data center stack.

Compal will showcase its latest AI server platforms, including OG231-2-L1, OG430-2-L1 and SGX30-2 systems which are optimized for AI model training and inference. Alongside its servers, Compal will present its Direct Liquid Cooling (DLC) technology, which removes heat directly from high-power GPUs to support the rack-level densities required by modern AI workloads.

Exascale Labs will present the infrastructure half of the stack. Its Modular Data Center (MDC) pre-integrates power, cooling, and networking inside a factory-built container, enabling rapid, repeatable deployment at the high rack densities required by modern GPU. Alongside the MDC, Exascale will demonstrate its HVDC / 800 V DC power architecture using Solid-State Transformers (SST), which eliminates multiple AC/DC conversion stages to deliver higher end-to-end efficiency, a simpler power path, and smaller electrical footprint - freeing more floor space for revenue-generating GPU racks.

"Compal builds some of the most advanced AI servers in the industry, and Exascale builds the modular, high-voltage infrastructure designed to power them at scale," said Dr. Hoansoo Lee, CEO of Exascale Labs. "By pairing Compal's AI servers and direct liquid cooling with our MDC and HVDC/SST stack, joint customers can move from purchase order to live AI capacity in months rather than years - without compromising on density or efficiency. COMPUTEX is the right stage to show the industry what this full pairing looks like in a single, deployable solution."

"AI workloads have pushed rack-level power and thermal requirements into territory that demands fresh thinking on both the server and the facility," said Alan Chang, Vice President, ISBG at Compal. "Our AI server platforms and DLC address the chip- and rack-level challenge; Exascale's modular data center and HVDC architecture address the building- and grid-level challenge. Co-presenting at COMPUTEX lets us show customers a single, deployment-ready answer to the exploding demand for AI compute - each company doing what it does best, integrated into one stack."

The integrated AI infrastructure showcase will be featured at Compal's booth (booth number M0804). Visitors and press are invited to experience live demonstrations of the integrated solution and to meet technical teams from both companies. The showcase underscores how Exascale and Compal are collaborating across the compute, cooling, infrastructure, and power layers to drive the next wave of AI data center innovation.

Exascale entered a business combination agreement with D. Boral ARC Acquisition I Corp. ("BCAR") in early 2026, positioning Exascale to be a publicly traded pure-play AI infrastructure deployment company. BCAR filed an investor presentation with the Securities and Exchange Commission in connection with the transaction. Exascale expects the transaction to close in the second half of 2026, and upon closing, the combined company ("PubCo") will operate as Exascale Labs Holdings Inc. The combined company expects to list on Nasdaq under the ticker XLAB.

About Exascale Labs

Exascale Labs is a next-generation AI infrastructure provider delivering end-to-end solutions across compute, cooling, power, and deployment. Exascale's core offerings include GPU-as-a-Service (GPUaaS), which provides reserved and on-demand access to high-performance GPU compute capacity globally, as well as GPU cluster management and optimization services. In addition, Exascale has developed modular data center (MDC), high-density cooling, HVDC/solid-state transformer (SST) power and energy storage solutions designed to address deployment bottlenecks in AI infrastructure. Exascale's platform is purpose-built for large-scale AI workloads, including LLM training, fine-tuning, and high-concurrency inference, and is engineered to help enterprise and industry partners move from purchase order to live AI capacity faster and more efficiently. For more information, please visit: https://www.exascalelabs.ai

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com