Kyocera International Inc.

01/14/2026 | Press release | Distributed by Public on 01/14/2026 11:08

SPIE Photonics West 2026 to Feature Kyocera’s Optical Components, Ceramic Package Solutions, and Assembly Services

SAN DIEGO - JAN. 14, 2026 - Kyocera will exhibit its latest optoelectronic products and technologies at two upcoming events in San Francisco's Moscone Center: SPIE Photonics West 2026, booth #4738, and SPIE AR/VR/MR 2026, booth #6509, Jan. 20 to 22.

Kyocera's Semiconductor Components Group offers a wide selection of ceramic multilayer packages, optical component solutions, and assembly services to support device integration and miniaturization in multiple fields. These include quantum, AR/VR/MR, medical, and laser/opto applications, as detailed below.

1. Quantum Technology Applications

- Ceramic packages / substrates for integrated packaging of quantum technologies.

- Other components such as sapphire carriers, glass-to-metal feedthroughs, and multi-sided windows to support specialized packaging for quantum technologies.

2.AR/VR/MRApplications

- Ceramic packages / window lids / thin film carriers for light sources used in micro-displays (laser beam scanning / MicroLED / LCOS).

- Ceramic packages for inertial, proximity, camera, microphone, and other sensors.

- PLC (Planar Lightwave Circuit) integrated packages and low-profile hermetic sealing caps.

- Metal heat sink materials and Ag sintering pastes for enhanced thermal solutions.

3.Biomedical Applications

- Ceramic packages for wearable monitoring devices.

- Ceramic packages for various sensors and medical devices.

- Alumina and zirconia-based optical components for dose-control devices.

4.Laser/Opto Applications

- Ceramic packages with heat spreaders / high-thermal-conductive substrates / hermetic sealing lids / Ag sintering pastes / superior heatsink materials for light sources and optical sensors.

- Glass-to-metal feedthroughs for accelerator-based Extreme Ultraviolet (EUV) lasers.

5. Semiconductor Microelectronic Assembly Services

- Wirebond assembly for multichip modules with MEMS sensors / hybrid assembly.

- Flip chip assembly with various thermal interface materials for photonics ICs, memory devices and 2.5D assemblies.

- Support for hermetic and non-hermetic solutions.

- High-reliability process flows for space, medical and other specific applications.

- RoHS compliant process flow.

- Highly engineered solutions.

- Multi-level component sourcing support.

Kyocera's Optical Components Group provides high-performance spherical, aspherical, free-form, and deep ultraviolet/infrared (DUV/IR) components, along with custom optical systems - including objective lenses, laser-optical units, and lithography optics - for semiconductor, medical, and quantum-computing applications.

Optical Solutions for Semiconductor Applications

- High-Numerical Aperture (NA) objective, tube, and lithography lenses for wafer & mask inspection, metrology, and lithography alignment systems.

- Deep Ultraviolet (DUV) optical components - such as mirrors and polarizing beam splitters (PBS) - with industry-leading laser-damage thresholds; standard wavelengths offered at 193nm, 213nm, and 266nm.

- Custom F-theta and scanning optics engineered for uniform spot performance in laser annealing, scribing, and materials-processing.

Optical Solutions for Life-Science Applications

- High-NA microscope objective lenses, relay lenses, and tube lenses for fluorescence microscopy, cell analysis, and multi-wavelength detection instruments.

- Optical units integrating objective, relay, and tube lenses - supplied for DNA sequencers, cell-analysis systems, and flow cytometry instruments.

- Support for small-diameter aspherical lenses (e.g., 1.4mm diameter class) for miniaturized bio-imaging applications.

Optical Solutions for Quantum Technology

- Supporting optical systems for next-generation quantum applications, including neutral-atom and ion-trap platforms, by providing high-NA objective and tube lenses designed for large-field imaging, precise beam delivery, and optical addressing.

- Optical design support using ultra-low wavefront error (WFE) components covering DUV-IR wavelengths, optimized for operation in vacuum, cryogenic, and vibration-sensitive environments required in quantum experiments.

Other Applications

- Kyocera provides optical solutions supporting a wide range of industrial and consumer applications, including automotive imaging, laser systems, sensors, scanners, and general opto-mechatronic equipment.

- Kyocera's aspherical lenses - including small-diameter types - are available in multiple sizes (approx. between 1.0 and 55.0mm diameter), offering excellent correction of spherical and chromatic aberrations, contributing to optical system miniaturization.

- Glass, plastic, and free-form lenses can be customized for cameras, scanners, and various imaging modules across industrial and consumer markets.

For inquiries, questions or technical consultations on any of the above products and services, please email [email protected]

About KYOCERA

San Diego-based Kyocera International, Inc. is a wholly owned subsidiary of Kyocera Corporation.

Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as "advanced ceramics"). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2025, the company's consolidated sales revenue totaled 2.0 trillion yen (approx. US$13.5 billion*). Kyocera is ranked #1123 on Forbes magazine's 2025 "Global 2000" list of the world's largest publicly traded companies and has been named by The Wall Street Journal among "The World's 100 Most Sustainably Managed Companies."

*Conversion rate based on trailing 12 months (TTM) at March 31, 2025

© 2026 Kyocera International, Inc.

Kyocera International Inc. published this content on January 14, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on January 14, 2026 at 17:08 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at [email protected]