Why We Invested in HEXAspec: High Performance h-BN Composite Materials for Semiconductor Packaging

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We also know this team. We met Tianshu years ago, when HEXAspec was still a lab project, and we watched the company take shape before we wrote a check. What stood out over that time was how they grew. They took hard feedback, came back sharper, and built real relationships across an industry that doesn't open its doors easily. Today they're in technical conversations with names like TSMC, Micron, and SK Hynix, and they're part of NVIDIA's Inception program.

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There's a long road ahead. Chipmakers are careful, and testing new materials takes time. But the problem is urgent, the science is real, and nobody has to rebuild a factory to say yes. That's why we led HEXAspec's pre-seed round, and why we think they're the team to help chips beat the heat.

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