Smoltek Showcases Ultra-Thin Capacitor Technology for Next-Generation AI and High-Performance Computing

• Smoltek Semi, show­cased its ultra-thin capac­i­tor tech­nol­o­gy CNF-MIM (Car­bon Nanofiber Met­al-Insu­la­tor-Met­al) at Semi­con Tai­wan 2025 (Sep­tem­ber 10-12).
• The tech­nol­o­gy is intend­ed for pow­er sup­ply in AI chips, high-per­for­mance com­put­ing (HPC) sys­tems and edge devices.
• CNF-MIM com­bines high capac­i­tance den­si­ty, low ESL and ESR and very thin form fac­tor - enabling advanced inte­gra­tion near/​under proces­sors. These prop­er­ties are cru­cial for the next gen­er­a­tion of chips.
• Unlike tra­di­tion­al deep trench capac­i­tors (DTC), Smoltek uses an addi­tive process where car­bon nanofibers grow direct­ly on the sub­strate. This allows struc­tures with high aspect ratios and large areas, and a dielec­tric that can be applied in an ALD step, which can reduce costs.

Quotes about Smoltek's CNF-MIM Tech­nol­o­gy

Dr. Arthur Lin (ITRI): Empha­sizes that AI servers require high speed and low pow­er con­sump­tion, and that heat and ener­gy sav­ing are key. He believes that the CNF-MIM tech­nol­o­gy, with its high aspect ratio and large spe­cif­ic sur­face area, is a tech­ni­cal advantage.

Mag­nus Ander­s­son, CEO of Smoltek: Sees the choice to present the tech­nol­o­gy at Semi­con Tai­wan as a val­i­da­tion of the com­pa­ny's strat­e­gy. He also says that the mar­ket for AI, HPC and edge com­put­ing requires sta­ble, ener­gy-effi­cient and minia­tur­ized pow­er solutions.

Read the offi­cial press release here: Smoltek Show­cas­es Ultra-Thin Capac­i­tor Tech­nol­o­gy for Next Gen­er­a­tion AI and High Per­for­mance Com­put­ing.