Murata Develops 6G Antenna Module for Frequencies Above 100 GHz Demonstrating wireless communication at 135 GHz, wideband signal transmission using up to 8 GHz of bandwidth,[...]

Murata Manufacturing Co., Ltd. (hereinafter "Murata") has developed an antenna module^*1 (hereinafter "module") compatible with the D-band (110 to 170 GHz) high-frequency band exceeding 100 GHz expected to be used in 6G. The results of the communication evaluation for this module verified wireless communication at 135 GHz, signal transmission using bandwidths of up to 8 GHz, and two-dimensional beam control^*2 for both transmission and reception. This outcome represents the world's first^*3 LTCC^*4 antenna module to support D-band operation and two-dimensional beam control for both transmission and reception. This module is expected to be put to use in a wide range of applications that require high-speed and high-capacity communications, including 6G communications.

^{*1 Antenna module: an integrated module that combines an antenna with the high-frequency circuitry needed to transmit, receive, and control wireless signals. Such modules are used in 5G and other high-frequency wireless communication equipment and are expected to also be utilized in 6G communications.
*2 Two-dimensional beam control: a technology that controls the direction of radio wave beams both vertically and horizontally. This is an important technology for achieving high-speed and high-capacity communications while maintaining communication quality in 6G communications using high-frequency bands exceeding 100 GHz.
*3 Based on a survey conducted by Murata as of October 4, 2026.
*4 LTCC (Low-Temperature Co-Fired Ceramics): a substrate technology in which wiring, etc., is formed on multiple ceramic sheets, which are then laminated and fired. In addition to enabling high-frequency signal transmission with low loss, LTCC is well-suited for developing miniature, high-density electronic circuits.}

In recent years, the growing expectation toward the realization of a society that collects, analyzes, and utilizes in real time massive amounts of data obtained from the real world through physical AI, digital twins, and other technologies is driving the demand for higher speed and higher capacity communications. To achieve high-speed, high-capacity communications, it is important to secure a wide bandwidth (the range of frequencies available for communication) to increase the amount of information that can be transmitted.

Currently, mobile communications such as 4G and 5G primarily use frequencies in bands ranging from several GHz up to 28 GHz. However, these existing frequency bands are already used by various wireless systems including broadcast and satellite communications, which makes it difficult to secure additional spectrum. Accordingly, next-generation 6G communication systems will utilize frequencies above 100 GHz, which have previously seen limited use in mobile communications, and are expected to secure bandwidth on the scale of several GHz.

On the other hand, because radio wavelengths become shorter as the frequency increases, the antennas and high-frequency circuitry must be designed and mounted with high precision tailored to such wavelengths. Moreover, because slight differences in wiring lengths and mounting variations significantly impact communication performance in high-frequency communications, it has been a challenge to realize antenna modules that combine high communication performance with miniaturization and mountability while supporting high-frequency bands.

To address this issue, Murata conducted joint research with imec^*5, one of the world's leading R&D institutions focused on advanced semiconductor technologies, and developed an antenna module that achieves wireless communication at 135 GHz, signal transmission using bandwidths of up to 8 GHz, and two-dimensional beam control for both transmission and reception based on Murata's proprietary LTCC substrate technology.

Murata possesses the technology foundation to handle everything from materials to products and also develops the ceramic materials used in the LTCC substrates in-house. By optimizing the LTCC substrate material for this application, Murata achieved a low dielectric constant and low dielectric loss tangent^*6 suitable for high-frequency communications, helping to reduce signal loss even at frequencies above 100 GHz.

In addition, by leveraging the high-frequency design and packaging technologies cultivated by Murata and combining the LTCC substrate with a D-band-compatible (110 to 170 GHz) beamforming IC^*7 developed by imec, while also integrating the antenna, RF wiring, and other components with high precision and high density, Murata developed this module, which balances high communication performance with miniaturization and mountability.

^{*5 imec: headquartered in Leuven, Belgium, imec is one of the world's leading independent R&D institutions in the fields of nanoelectronics and digital technologies. imec researches and develops advanced semiconductors, AI, next-generation communications and sensing, etc., and also promotes joint research with companies, universities, and research institutions worldwide.
*6 Low dielectric loss tangent: a characteristic that refers to low energy loss by electrical signals within a material. This characteristic enables the efficient transmission of high-frequency signals.
*7 Beamforming IC: a semiconductor that controls radio waves sent and received from multiple antennas to direct the radio waves toward the intended device. This is a critical technology for achieving stable communication in 6G, which uses high-frequency communications.}

These results demonstrated the feasibility of a key technology needed to achieve the high-speed and high-capacity communications required by 6G.

The technology could also be applied to radar sensing using the sub-terahertz band required for the physical AI era as well as ISAC^*8, which integrates communication and sensing.

Furthermore, Murata will leverage its proven track record of mass production with the LTCC manufacturing process to advance technology development toward practical use and volume production, targeting commercialization from 2030 onward.

Going forward, Murata will continue to apply its unique insights and technologies cultivated in the communications field to contribute to the advancement of 6G and other next-generation communication technologies.

^{*8 ISAC (Integrated Sensing and Communication): a technology that integrates communication and sensing functions in the same wireless system (technology that detects the surrounding environment, object positions and movements, etc.).}

Murata in Brief