Company Presentation (AEHR FY26Presentation 1 13 26)

Setting the Test Standard for Tomorrow

Aehr Test Confidential

January 2026 Nasdaq: AEHR

Aehr Test Systems Company Overview

Semiconductor Test & Burn-in for over 45 Years!

XP

• Worldwide leader in wafer-level test and burn-in systems
• Unique full-wafer test and burn-in systems and contactors
• Technology leader in massively parallel and high-power test and burn-in systems

• 2 High Power Multi-Wafer Test & Burn-In System

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  CP

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  Single Wafer Stepping Test & Burn-In System High Power Test & Burn-In System

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  Medium Power Test & Burn-In System

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  Aehr Manufacturing Capacity

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  • State-of-the-art manufacturing facility located in Fremont, CA
  • 50,000+ sq. foot facility

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  • Power and Infrastructure to support up to 400 wafers (tester Blades) and WaferPaks for Wafer Level Burn-in and 20 Packaged-Part Burn-in Systems per month

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  • Manufacturing capabilities and quality control procedures have passed rigorous Tier 1 customer qualification processes

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Aehr Fremont Production Floor

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Aehr Test Systems Market Drivers

Need for cost-efficient wafer level, singulated die, and packaged part burn-in, stabilization, & testing is creating significant revenue opportunities for Aehr Test in the following key markets:

• Artificial Intelligence Processors and Processing Infrastructuredriving explosive spend in data center processing, edge processors, communication infrastructure, and power conversion infrastructure which drives AI processors, memory, data storage, Silicon Photonics I/O, and power conversion semiconductors like Silicon Carbide & Gallium Nitride
• Electric Vehicle & Electrification of Transportation Infrastructuredriving motor control, charging infrastructure, and power conversion using Silicon Carbide & Gallium Nitride semiconductors
• Electrification of the World's Power Infrastructure and Shift to Clean Energydriving efficient and economical electrical power conversion using Silicon Carbide & Gallium Nitride semiconductors
• Data Center Infrastructure and unstoppable growth in Data Storagedriving Silicon Photonics, Flash Memory Solid State Data Storage, and new Photonics Assisted Hard Disk Drive Storage
• Worldwide 5G Infrastructurebuild out using Silicon Photonics fiber optic transceivers and new Optical Network Switches
• Heterogeneous Integration of semiconductors and 3D fabrication and stackingdriving technology and cost roadmaps pushing known good die with test and burn-in of device in wafer form prior to packaging

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Aehr Test Headquarters,

Fremont California

Aehr has been a leader in burn-in test solutions for over 45 years

with thousands of systems shipped worldwide

(Partial Customer List)

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Worldwide Customer Base

AI Processor Wafer Level vs Package Burn-in Flow

Packaged Part Burn-In Test Flow

Aehr Sonoma

Wafer Test

Packaging

Pkg Test 1

Package Burn-In

Pkg Test 2

SLT

Aehr FOX-XP

Wafer Burn-In

Wafer Test

Packaging

Pkg Test

SLT

Wafer Level Burn-In Test Flow - High Quality Bare Die

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Proprietary Wafer Level Enabling Technology

• Aehr's FOX-XP is capable of both functional burn-in and test solutions - leverages proprietary aligner and contactor technology
• Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint - while increasing die yield and throughput

• MULTI-WAFER TESTER FOX-XP Multi-Wafer Test System CONTACTOR FOX-XP WaferPaks ALIGNER FOX WaferPak Aligner

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  • May be configured with up to 18 Blades, enabling 18 wafers to be tested in parallel - driving cost efficiency and throughput
  • High performance thermal chucks allow uniform temperature control of the wafers
  • Footprint similar to single wafer automated test equipment -reducing lab test space
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  • Houses the wafer and distributes signals and power to the wafer itself
  • The WaferPak contactor is capable of over 50,000 contacts in a single touchdown on up to 300mm wafers
  • Consumable input into the test system driving recurring revenue from the installed base
  • Integral piece of test cell as it loads the wafer in the WaferPak at immense levels of precision
  • By perfectly setting the wafer in a cartridge it ensures perfect contact
  • Performs wafer alignment "offline" which eliminates the need for one wafer prober per wafer during long burn-in and test times

Aehr Wafer Level Test & Burn-in Patents

• WaferPak temperature control methods

  • Vacuum & pressure-based WaferPaks

    • Maintaining probe contact over temperature

      • Electrical components in WaferPak

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  • Individual DUT power supplies

    • Per Die Current Protection

      • Redundant power supplies

      • Portable WaferPaks

      • And more . . .

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FOX-XP Multi-Wafer Production Test & Burn-In System

• 9 / 18 wafer system high volume production

  • FOX-P blades configurable with same resource options as FOX-NP and FOX-CP blades
  • Delivers up to 2,048 independent universal channels or 1,024 High current or high voltage channels per blade
  • Delivers and dissipates up to 3.5kW of power and up to 4,000 amps to and from the wafer
• Uses FOX compatible WaferPaks

• FOX-XP 18 Wafer Test & Burn-In System

• Up to 50,000 pin "probe cards"
• Very high compliance micro pogo pins and/or MEMS capability
• Test & burn-in temperatures to 150C

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• Offline wafer alignment via Aehr proprietary WaferPak aligners

FOX WaferPaks

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