Semiconductor Digest: Co-Packaged Optics: Test Challenges for Data Center Technology of the Future

AI-driven data centers are reaching new limits in speed and efficiency, driving the need for technologies that can deliver higher bandwidth with lower power. Silicon photonics (SiPh) is emerging as a critical solution, enabling reduced energy use while improving bandwidth and latency.

With this shift, automated test equipment (ATE) plays a vital role in addressing the unique challenges of SiPh integration and ensuring performance and quality at scale.

InSemiconductor Digest, Teradyne's Jeorge Hurtarte shares his perspective on how SiPh is shaping the future of data center infrastructure and how test strategies are evolving to keep pace.

Read the full article, Co-Packaged Optics: Test Challenges for Data Center Technology of the Future, published by Semiconductor Digest

Dr. Jeorge S. Hurtarte is currently Senior Director and Principal Marketing Strategist in the Semiconductor Compute Test Division at Teradyne. Jeorgehas held various technical, management and executive positions at Teradyne, Lam Research, LitePoint, TranSwitch, and Rockwell Semiconductors. Jeorgeis in the Advisory Board of SEMI of North America and serves as co-chair of the IEEE Heterogeneous Integration Roadmap (HIR) Test Chapter. Jeorgeholds a PhD in Electrical Engineering, and three master's degrees (MBA, Computer Science, and Telecommunications). He is also visiting professor at the University of California, Santa Cruz and at the University of Phoenix. He is co-author of the book Understanding Fabless IC Technology.