Resonac Signs MOU with BEAM TECHNOLOGIES, Japan LEO Shachu and other partners for Semiconductor Manufacturing in Low Earth Orbit~ Aiming for Breakthroughs through[...]

June 25, 2026
Resonac Holdings Corporation

TOKYO, Japan - Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter "Resonac") announced that Resonac has signed a memorandum of understanding (MOU) with BEAM TECHNOLOGIES INC. ("BEAM TECHNOLOGIES"), Japan LEO Shachu, Inc. ("Japan LEO Shachu"), and other partners to realize semiconductor manufacturing in Low Earth Orbit (LEO).

As technologies such as IoT, AI, and 6G communications increasingly permeate every aspect of society, improving semiconductor performance and ensuring a stable supply-both of which underpin these technologies-have become critical challenges affecting national industrial competitiveness and economic security. However, conventional semiconductor manufacturing on Earth faces several challenges, including the physical limits of miniaturization and performance ceilings caused by crystal defects generated during manufacturing processes. In addition, geopolitical risks have exposed vulnerabilities in the global semiconductor supply chain.

Following the planned retirement of the International Space Station (ISS) around 2030, activities in Low Earth Orbit are expected to transition to a private-sector-led market. In the United States, multiple private companies are already developing commercial space stations, while Europe is exploring collaborative initiatives. Meanwhile, China, Russia, and India are also aiming to secure their own orbital platforms.

In Japan, Japan LEO Shachu has been selected for funding under JAXA's Space Strategy Fund for "LEO Autonomous Flying Module System Technology." Full-scale development of the "Japan Module" began in 2025, with the aim of establishing a sustainable ecosystem for space utilization in the post-ISS era from around 2030 onward.

【Solution】
In conventional crystal growth processes conducted on Earth, the following gravity-induced physical constraints have been major bottlenecks preventing improvements in device power efficiency and manufacturing yield:

1. Composition non-uniformity caused by thermal convection: Natural convection resulting from density differences during heating induces uneven dopant distribution and impurity contamination.
2. Structural distortion due to hydrostatic pressure: Stress caused by the crystal's own weight can generate dislocations and defects within the crystal lattice, degrading voltage tolerance.
3. Contamination from container walls: In high-temperature growth processes, impurities may enter the crystal from contact points such as crucibles, reducing carrier mobility.

The microgravity environment of space can suppress convection and the formation of crystal defects that cannot be eliminated on Earth. This enables the growth of compound semiconductor crystals with extremely high crystalline quality.

By utilizing this "ultimate environment," it is expected that compound semiconductors with performance levels-high purity, high efficiency, and high durability-unattainable through terrestrial manufacturing can be realized.

【Market Size】
The global compound semiconductor market is projected to grow from approximately 18 trillion yen in 2024 to about 26 trillion yen by 2033*. Key drivers include the expanding demand for high-speed optical communication devices for data centers (such as laser diodes) and energy-efficient power supplies due to the rapid growth of AI-related applications. Additionally, the spread of electric vehicles (EVs) and autonomous vehicles is increasing demand for next-generation power semiconductors and optical sensors such as LiDAR, as well as communication semiconductors.
Compound semiconductors are also being incorporated into a wide range of next-generation IT and IoT devices, including smartphones (high-frequency devices for 5G/6G), home appliances, and industrial equipment, further broadening the market base.

Furthermore, as semiconductors become increasingly important from the perspective of economic security, governments worldwide are providing substantial policy support, accelerating manufacturing capacity expansion and R&D activities. BEAM TECHNOLOGIES, Resonac, and their partners plan to supply high-performance semiconductors-unachievable through terrestrial manufacturing-to these markets. *Source: IMARC Group, "Compound Semiconductor Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2025-2033"

【Future Outlook】
Based on the Basic Plan on Space Policy (approved by the Cabinet on June 13, 2023), Japan is advancing a comprehensive space technology strategy that brings together the nation's world-class technologies. Various technological demonstrations and commercial uses are planned for the Japan Module currently under development by Japan LEO Shachu.

Among materials-related fields, Resonac will collaborate with partners to build a "next-generation manufacturing platform utilizing microgravity," particularly in compound semiconductors-an area with strong market potential, a solid industrial base in Japan, and technological advantages. The goal is to realize compound semiconductor manufacturing in the Japan Module, which is planned to connect to a commercial space station after 2030.

【Company Overview】

BEAM TECHNOLOGIES INC.
Head Office: 9-3 Nibancho, Chiyoda-ku, Tokyo, Japan
Representative Director: Kazuki Iimura
Established: March 2022
Business: Design and development of compound semiconductors

Japan LEO Shachu, Inc.
Head Office: 2-1-1 Nihonbashi, Chuo-ku, Tokyo, Japan
President and CEO: Yudai Yamamoto
Established: July 2024
Business: Development of commercial cargo resupply spacecraft / Development of the Japan Module / Devel opment of LEO utilization

Resonac Corporation
Head Office: 1-9-1 Higashi-Shimbashi, Minato-ku, Tokyo, Japan
President and CEO: Hidehito Takahashi
Established: October 1962
Business: Manufacturing and sales of functional chemicals and materials, including semiconductor materials