TRI - Test Research Inc.

09/17/2025 | News release | Distributed by Public on 09/17/2025 01:30

TRI's Inspection Solution at PSECE 2025

[September 17, 2025 - Pasay City, Philippines ]
Wire Techniks, TRI's distributor, will join the 20th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) at the SMX Convention Center Manila, from October 28 to 30, 2025. Visit Booth No.229/230 to discuss the latest in Inspection and Metrology for the advanced packaging and semiconductor industry.

Wire Techniks will exhibit TRI's AI-powered 3D AOI, TR7700QH SII. The TR7700QH SII can inspect at speeds of up to 80 cm2/sec while maintaining uncompromised Gauge R&R. The 3D AOI is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities.

TRI provides a wide range of inspection and metrology solutions for the semiconductor industry, covering applications such as Advanced WLP, Patterned Wafer, Wafer Bumping, TSV Metrology, and Die/Wire Bonding. TRI's solutions can inspect for defects after sawing, underfill, and epoxy, ensuring the quality of Chiplet, Chip-on-Wafer (CoW), and System-in-Package (SiP) assemblies.

For more information about TRI's SEMI Inspection and Metrology Solutions, please visit the link below,
https://www.tri.com.tw/en/product/product-85-2.html

TRI - Test Research Inc. published this content on September 17, 2025, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on September 17, 2025 at 07:30 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at [email protected]