IT Park Uzbekistan and HKSTP Discuss Expanding Cooperation in Sta...

IT Park Uzbekistan and HKSTP Discuss Expanding Cooperation in Startups, AI and R&D

As part of ICT WEEK Uzbekistan 2026, Dildora Nasibullayeva, Head of International Relations at IT Park Uzbekistan, held a meeting with Ankit Sethi, Senior Manager for Regional Partnerships and Channel Development in the Middle East at Hong Kong Science and Technology Park (HKSTP).

The parties discussed further development of cooperation between IT Park Uzbekistan and HKSTP, including support for technology companies entering new markets, strengthening ties between startup ecosystems, and opportunities for joint work in artificial intelligence and R&D.

Particular attention was paid to the participation of four HKSTP startups at ICT WEEK Uzbekistan 2026. During their visit, the companies have already held meetings with Uzinfocom, Uztelecom, and TUIT. The parties discussed opportunities for further engagement with these companies and supporting their entry into the Uzbek market.

The meeting also covered opportunities to organize visits by Uzbek startups to Hong Kong, enabling them to connect with companies and explore HKSTP's technological infrastructure, as well as exchange experience between participants of the two ecosystems.

Cooperation between IT Park Uzbekistan and HKSTP has been developing consistently. In July 2026, the parties signed a Memorandum of Understanding, while in August, a dedicated webinar was held for HKSTP companies and startups on opportunities to enter the Uzbek market. In September, cooperation continued during the visit of an IT Park Uzbekistan delegation to Hong Kong to participate in the Belt and Road Summit 2026.

Hong Kong Science and Technology Park is one of Hong Kong's key innovation platforms, focused on R&D and deep-tech development. The HKSTP ecosystem brings together more than 2,400 technology companies from 26 countries and over 17,000 R&D professionals, with key focus areas including artificial intelligence, robotics, biotechnology, fintech, smart city solutions, and advanced manufacturing.