Mipox Corporation

08/26/2026 | Press release | Distributed by Public on 08/26/2026 01:28

Exibition Information 'SEMICON TAIWAN 2026'

Mipox's room temperature bonding service handles projects combining silicon wafers, compound semiconductor wafers, oxide wafers, ceramic material wafers, and others, with a focus on prototyping for power semiconductor applications, surface wave filter applications, high frequency devices, various MEMS and LED applications.

Room-Temperature Wafer Bonding

Mipox Corporation published this content on August 26, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on August 26, 2026 at 07:31 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at [email protected]